Matching of IC Patterns under Non-Uniform Illumination
نویسندگان
چکیده
The use of hierarchical Chamfer Matching (CM) to match die patterns on VLSI wafers for the alignment of semiconductor chips is presented. This method can extract images with non-umform lighting (without loss) for matching, and somehow it is invariant to some environment changes. Here, it is applied to align IC patterns under non-uniform lighting while the normalized correlation method fails. Experimental results are given.
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